MEMS for practical applications

Masayoshi Esashi

doi:10.1007/978-90-481-3807-4_3

MEMS for practical applications

Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Abstract

Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO₃ for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.

Original language	English
Title of host publication	Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
Publisher	Springer Verlag
Pages	31-40
Number of pages	10
ISBN (Print)	9789048138050
DOIs	https://doi.org/10.1007/978-90-481-3807-4_3
Publication status	Published - 2010

Publication series

Name	NATO Science for Peace and Security Series B: Physics and Biophysics
ISSN (Print)	1874-6500

Keywords

Gyroscope
Integrated sensor
LTCC
MEMS
Microphone
Optical scanner
Packaging
Pressure sensor
Probe card
SAW (Surface Acoustic Wave)
SiC
Switch
Transponder

ASJC Scopus subject areas

Biotechnology
Biophysics
Physics and Astronomy(all)
Electrical and Electronic Engineering

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10.1007/978-90-481-3807-4_3

Cite this

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abstract = "Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO3 for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.",

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author = "Masayoshi Esashi",

year = "2010",

doi = "10.1007/978-90-481-3807-4_3",

language = "English",

isbn = "9789048138050",

series = "NATO Science for Peace and Security Series B: Physics and Biophysics",

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AB - Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO3 for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.

KW - Gyroscope

KW - Integrated sensor

KW - LTCC

KW - MEMS

KW - Microphone

KW - Optical scanner

KW - Packaging

KW - Pressure sensor

KW - Probe card

KW - SAW (Surface Acoustic Wave)

KW - SiC

KW - Switch

KW - Transponder

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U2 - 10.1007/978-90-481-3807-4_3

DO - 10.1007/978-90-481-3807-4_3

M3 - Chapter

AN - SCOPUS:77949531095

SN - 9789048138050

T3 - NATO Science for Peace and Security Series B: Physics and Biophysics

SP - 31

EP - 40

BT - Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

PB - Springer Verlag

ER -

MEMS for practical applications

Abstract

Publication series

Keywords

ASJC Scopus subject areas

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