MEMS for practical applications

Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO3 for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.

Original languageEnglish
Title of host publicationAdvanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators
EditorsEvgeni Gusev, Eric Garfunkel, Arthur Dideikin
Pages31-40
Number of pages10
DOIs
Publication statusPublished - 2010 Mar 23

Publication series

NameNATO Science for Peace and Security Series B: Physics and Biophysics
ISSN (Print)1874-6500

Keywords

  • Gyroscope
  • Integrated sensor
  • LTCC
  • LiNbO
  • MEMS
  • Microphone
  • Optical scanner
  • Packaging
  • Pressure sensor
  • Probe card
  • SAW (Surface Acoustic Wave)
  • SiC
  • Switch
  • Transponder

ASJC Scopus subject areas

  • Biotechnology
  • Biophysics
  • Physics and Astronomy(all)
  • Electrical and Electronic Engineering

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