MEMS for practical application with attention to packaging

Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

MEMS (Micro Electro Mechanical Systems) has been studied for practical applications with attention to packaging. Wafer level packaged devices as integrated capacitive pressure sensor, MEMS relay and electrostatically levitated rotational gyroscope and arrayed MEMS as multi-probe data storage and multi-column electron beam lithography system have been developed. Electrical feedthroughs in glass play important roles in the wafer level packaging and the arrayed MEMS. Materials as diamond for recording probe and carbon nano tube for electron field emitter are utilized in the MEMS for their functionalities.

Original languageEnglish
Title of host publication2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers
Pages11-14
Number of pages4
DOIs
Publication statusPublished - 2006 Dec 1
Event2006 International Microsystems, Packaging, Assembly Conference Taiwan, IMPACT - Taipei, Taiwan, Province of China
Duration: 2006 Oct 182006 Oct 20

Publication series

Name2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers

Other

Other2006 International Microsystems, Packaging, Assembly Conference Taiwan, IMPACT
CountryTaiwan, Province of China
CityTaipei
Period06/10/1806/10/20

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'MEMS for practical application with attention to packaging'. Together they form a unique fingerprint.

Cite this