Melting and solidification behaviour of lead nanoparticles embedded in amorphous and quasicrystalline matrices of Al-Cu-V

Alok Singh, A. P. Tsai

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)

Abstract

Melting and solidification behaviour of lead particles of size about 30 nm has been studied in amorphous and quasicrystalline matrices of an Al75Cu15V10 alloy. The lead particles had semi-shperical morphology, and often showed twinning. The particles showed a depression in the melting temperature by about 17°C in the amorphous matrix and about 6°C in the quasicrystalline matrix, as compared to the bulk melting temperature. On solidification an undercooling of greater than 60°C is obtained. The lowering of the melting temperature and a high undercooling on solidification is qualitatively explained to be due to the interfacial energies of the liquid or solid lead with the matrix.

Original languageEnglish
Pages (from-to)4082-4087
Number of pages6
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume39
Issue number7 A
Publication statusPublished - 2000 Dec 1
Externally publishedYes

Keywords

  • Aluminum-copper-vanadium
  • Amorphous matrix
  • Lead
  • Melting
  • Nanoparticle
  • Quasicrystalline matrix
  • Solidification

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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