Abstract
Melting and solidification behaviour of lead particles of size about 30 nm has been studied in amorphous and quasicrystalline matrices of an Al75Cu15V10 alloy. The lead particles had semi-shperical morphology, and often showed twinning. The particles showed a depression in the melting temperature by about 17°C in the amorphous matrix and about 6°C in the quasicrystalline matrix, as compared to the bulk melting temperature. On solidification an undercooling of greater than 60°C is obtained. The lowering of the melting temperature and a high undercooling on solidification is qualitatively explained to be due to the interfacial energies of the liquid or solid lead with the matrix.
Original language | English |
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Pages (from-to) | 4082-4087 |
Number of pages | 6 |
Journal | Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers |
Volume | 39 |
Issue number | 7 A |
DOIs | |
Publication status | Published - 2000 |
Externally published | Yes |
Keywords
- Aluminum-copper-vanadium
- Amorphous matrix
- Lead
- Melting
- Nanoparticle
- Quasicrystalline matrix
- Solidification
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)