Melting and solidification behaviour of lead nanoparticles embedded in amorphous and quasicrystalline matrices of Al-Cu-V

Alok Singh; A. P. Tsai

Melting and solidification behaviour of lead nanoparticles embedded in amorphous and quasicrystalline matrices of Al-Cu-V

Alok Singh, A. P. Tsai

Research output: Contribution to journal › Article › peer-review

Abstract

Melting and solidification behaviour of lead particles of size about 30 nm has been studied in amorphous and quasicrystalline matrices of an Al₇₅Cu₁₅V₁₀ alloy. The lead particles had semi-shperical morphology, and often showed twinning. The particles showed a depression in the melting temperature by about 17°C in the amorphous matrix and about 6°C in the quasicrystalline matrix, as compared to the bulk melting temperature. On solidification an undercooling of greater than 60°C is obtained. The lowering of the melting temperature and a high undercooling on solidification is qualitatively explained to be due to the interfacial energies of the liquid or solid lead with the matrix.

Original language	English
Pages (from-to)	4082-4087
Number of pages	6
Journal	Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume	39
Issue number	7 A
Publication status	Published - 2000 Dec 1
Externally published	Yes

Keywords

Aluminum-copper-vanadium
Amorphous matrix
Lead
Melting
Nanoparticle
Quasicrystalline matrix
Solidification

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

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@article{83966bef0ced46c3a935998328310db6,

title = "Melting and solidification behaviour of lead nanoparticles embedded in amorphous and quasicrystalline matrices of Al-Cu-V",

abstract = "Melting and solidification behaviour of lead particles of size about 30 nm has been studied in amorphous and quasicrystalline matrices of an Al75Cu15V10 alloy. The lead particles had semi-shperical morphology, and often showed twinning. The particles showed a depression in the melting temperature by about 17°C in the amorphous matrix and about 6°C in the quasicrystalline matrix, as compared to the bulk melting temperature. On solidification an undercooling of greater than 60°C is obtained. The lowering of the melting temperature and a high undercooling on solidification is qualitatively explained to be due to the interfacial energies of the liquid or solid lead with the matrix.",

keywords = "Aluminum-copper-vanadium, Amorphous matrix, Lead, Melting, Nanoparticle, Quasicrystalline matrix, Solidification",

author = "Alok Singh and Tsai, {A. P.}",

year = "2000",

month = dec,

day = "1",

language = "English",

volume = "39",

pages = "4082--4087",

journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",

issn = "0021-4922",

publisher = "Japan Society of Applied Physics",

number = "7 A",

}

TY - JOUR

T1 - Melting and solidification behaviour of lead nanoparticles embedded in amorphous and quasicrystalline matrices of Al-Cu-V

AU - Singh, Alok

AU - Tsai, A. P.

PY - 2000/12/1

Y1 - 2000/12/1

N2 - Melting and solidification behaviour of lead particles of size about 30 nm has been studied in amorphous and quasicrystalline matrices of an Al75Cu15V10 alloy. The lead particles had semi-shperical morphology, and often showed twinning. The particles showed a depression in the melting temperature by about 17°C in the amorphous matrix and about 6°C in the quasicrystalline matrix, as compared to the bulk melting temperature. On solidification an undercooling of greater than 60°C is obtained. The lowering of the melting temperature and a high undercooling on solidification is qualitatively explained to be due to the interfacial energies of the liquid or solid lead with the matrix.

AB - Melting and solidification behaviour of lead particles of size about 30 nm has been studied in amorphous and quasicrystalline matrices of an Al75Cu15V10 alloy. The lead particles had semi-shperical morphology, and often showed twinning. The particles showed a depression in the melting temperature by about 17°C in the amorphous matrix and about 6°C in the quasicrystalline matrix, as compared to the bulk melting temperature. On solidification an undercooling of greater than 60°C is obtained. The lowering of the melting temperature and a high undercooling on solidification is qualitatively explained to be due to the interfacial energies of the liquid or solid lead with the matrix.

KW - Aluminum-copper-vanadium

KW - Amorphous matrix

KW - Lead

KW - Melting

KW - Nanoparticle

KW - Quasicrystalline matrix

KW - Solidification

UR - http://www.scopus.com/inward/record.url?scp=0034215453&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034215453&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0034215453

VL - 39

SP - 4082

EP - 4087

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 7 A

ER -

Melting and solidification behaviour of lead nanoparticles embedded in amorphous and quasicrystalline matrices of Al-Cu-V

Abstract

Keywords

ASJC Scopus subject areas

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