Melting and solidification behaviour of lead nanoparticles embedded in amorphous and quasicrystalline matrices of Al-Cu-V

Melting and solidification behaviour of lead particles of size about 30 nm has been studied in amorphous and quasicrystalline matrices of an Al₇₅Cu₁₅V₁₀ alloy. The lead particles had semi-shperical morphology, and often showed twinning. The particles showed a depression in the melting temperature by about 17°C in the amorphous matrix and about 6°C in the quasicrystalline matrix, as compared to the bulk melting temperature. On solidification an undercooling of greater than 60°C is obtained. The lowering of the melting temperature and a high undercooling on solidification is qualitatively explained to be due to the interfacial energies of the liquid or solid lead with the matrix.