Mechanical stress monitoring sensor for 3-d module during manufacturing and operation

Koki Isobe, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In three-dimensional packaging module which have been used in electronic equipment, the size of partial interconnections and total structure have been continuously miniaturized for improving the performance of the products. Due to the fluctuation of the mechanical properties of the component materials and the drop impact towards the fragile modules during manufacturing and operation, the final residual stress varies easily in a chip of the 3-D structure. Both the static and dynamic changes of the stress distribution induce the variation of the performance of electronic devices and the degradation of their long-term reliability. It is, therefore, important to control and optimize the residual stress quantitatively. In this study, a stress sensor which can monitor the change of the local residual stress in 3-D module was developed by applying the piezoresistance effect of single-crystalline silicon. The sensor was embedded in a silicon chip, and it can measure the periodic stress in a silicon chip assembled by area-arrayed bump structure. The impact stress during the manufacturing process was successfully monitored by using this sensor. It was also confirmed that the effective amplitude of the impact stress varies drastically depending on the mechanical properties of the stacked thin films.

Original languageEnglish
Title of host publicationMicro- and Nano-Systems Engineering and Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791858455
DOIs
Publication statusPublished - 2017 Jan 1
EventASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017 - Tampa, United States
Duration: 2017 Nov 32017 Nov 9

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume10

Other

OtherASME 2017 International Mechanical Engineering Congress and Exposition, IMECE 2017
CountryUnited States
CityTampa
Period17/11/317/11/9

ASJC Scopus subject areas

  • Mechanical Engineering

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  • Cite this

    Isobe, K., Suzuki, K., & Miura, H. (2017). Mechanical stress monitoring sensor for 3-d module during manufacturing and operation. In Micro- and Nano-Systems Engineering and Packaging (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 10). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE201770323