Mechanical properties of intermetallic compounds formed at the interface between a tin bump and an electroplated copper thin film

Seongcheol Jeong, Yuki Sato, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

High density interconnection structures using an area-arrayed small bump structure have been employed in multi chip packages and modules. Both the diameter and the pitch of the bump will be decreased from a few hundred J..lm to dozens J..lm Copper thin film interconnection and lead-free solder (mainly consists of tin) is used for the micro joint structures. As a result, the intermetallic compounds (IMC such as CU6Sn5 and CU3Sn easily grow at th interface between the copper interconnections and the lead-free solder bumps. Since physical propertiesof the IMC are quite different from tin and copper the increase of thickness of the IMC in the joint structures may affect mechanical and electrical quality of the joint structures with the miniaturization of solder bump. One of the important change is the increase of the stress and strain fields in the bump structures. Since the stress and strain fields affect the fracture mode of structures, the change of the stress and strain fields due to the IMC growth was analyzed in small bump structures. In addition, the effect of the miniaturization of the bump size on the increase of the electrical resistance of the bump at high frequencies was also analyzed considering the existence of the IMC layer.

Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages149-152
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan, Province of China
Duration: 2008 Oct 222008 Oct 24

Publication series

Name2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan, Province of China
CityTaipei
Period08/10/2208/10/24

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

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    Jeong, S., Sato, Y., & Miura, H. (2008). Mechanical properties of intermetallic compounds formed at the interface between a tin bump and an electroplated copper thin film. In 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 (pp. 149-152). [4784251] (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008). https://doi.org/10.1109/EMAP.2008.4784251