Mechanical characterization of glass frit bonded wafers

K. Vogel, D. Wuensch, S. Uhlig, J. Froemel, F. Naumann, M. Wiemer, T. Gessner

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wafer bonding is a key technology in the manufacturing of microelectronic and micromechanical systems on industrial scale. Especially glass frit bonding is often used for t he encapsulation of MEMS devices on wafer level. To ensure the reliability of these bonds and to prevent critical failure of the systems, characteristic mechanical properties of the bonded interface are required. The fracture toughness and the shear strength are suitable values to characterize the bonding strength and can be determined by micro chevron and shear testing. They depend on the bonding parameters as well as the test speed. Due to the correlation between measured bonding strength and test speed a maximum test speed has to be identified to obtain reliable failure criteria regarding the fracture toughness and the shear strength.

Original languageEnglish
Title of host publication11th IMEKO TC15 Youth Symposium on Experimental Solid Mechanics 2012
PublisherIMEKO-International Measurement Federation Secretariat
Pages237-243
Number of pages7
ISBN (Electronic)9781634394321
Publication statusPublished - 2012 Jan 1
Externally publishedYes
Event11th IMEKO TC15 Youth Symposium on Experimental Solid Mechanics 2012 - Brasov, Romania
Duration: 2012 May 302012 Jun 2

Publication series

Name11th IMEKO TC15 Youth Symposium on Experimental Solid Mechanics 2012

Conference

Conference11th IMEKO TC15 Youth Symposium on Experimental Solid Mechanics 2012
CountryRomania
CityBrasov
Period12/5/3012/6/2

Keywords

  • Fracture toughness
  • Glass frit bonding
  • Influence of test speed
  • Shear strength
  • Stress intensity coefficient

ASJC Scopus subject areas

  • Mechanics of Materials
  • Materials Science(all)
  • Mechanical Engineering

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