Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages265-267
Number of pages3
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19/4/1719/4/20

Keywords

  • FHE
  • FOWLP
  • Stress Buffer Layer

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

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