Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

Yuki Susumago; Achille Jacquemond; Noriyuki Takahashi; Hisashi Kino; Tetsu Tanaka; Takafumi Fukushima

doi:10.23919/ICEP.2019.8733416

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

Yuki Susumago, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.

Original language	English
Title of host publication	2019 International Conference on Electronics Packaging, ICEP 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	265-267
Number of pages	3
ISBN (Electronic)	9784990218867
DOIs	https://doi.org/10.23919/ICEP.2019.8733416
Publication status	Published - 2019 Apr
Event	2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan Duration: 2019 Apr 17 → 2019 Apr 20

Publication series

Name	2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference	2019 International Conference on Electronics Packaging, ICEP 2019
Country	Japan
City	Niigata
Period	19/4/17 → 19/4/20

Keywords

FHE
FOWLP
Stress Buffer Layer

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Metals and Alloys

Access to Document

10.23919/ICEP.2019.8733416

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Cite this

Susumago, Y., Jacquemond, A., Takahashi, N., Kino, H., Tanaka, T., & Fukushima, T. (2019). Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 265-267). [8733416] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733416

Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application. / Susumago, Yuki; Jacquemond, Achille; Takahashi, Noriyuki; Kino, Hisashi ; Tanaka, Tetsu ; Fukushima, Takafumi.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 265-267 8733416 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Susumago, Y, Jacquemond, A, Takahashi, N, Kino, H , Tanaka, T & Fukushima, T 2019, Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733416, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 265-267, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19/4/17. https://doi.org/10.23919/ICEP.2019.8733416

Susumago Y, Jacquemond A, Takahashi N, Kino H , Tanaka T , Fukushima T. Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application. In 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 265-267. 8733416. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733416

Susumago, Yuki ; Jacquemond, Achille ; Takahashi, Noriyuki ; Kino, Hisashi ; Tanaka, Tetsu ; Fukushima, Takafumi. / Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 265-267 (2019 International Conference on Electronics Packaging, ICEP 2019).

@inproceedings{ae917a9fa7a047c98d234bf77308a79e,

title = "Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application",

abstract = "A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.",

keywords = "FHE, FOWLP, Stress Buffer Layer",

author = "Yuki Susumago and Achille Jacquemond and Noriyuki Takahashi and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima",

year = "2019",

month = apr,

doi = "10.23919/ICEP.2019.8733416",

language = "English",

series = "2019 International Conference on Electronics Packaging, ICEP 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "265--267",

booktitle = "2019 International Conference on Electronics Packaging, ICEP 2019",

note = "2019 International Conference on Electronics Packaging, ICEP 2019 ; Conference date: 17-04-2019 Through 20-04-2019",

}

TY - GEN

T1 - Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application

AU - Susumago, Yuki

AU - Jacquemond, Achille

AU - Takahashi, Noriyuki

AU - Kino, Hisashi

AU - Tanaka, Tetsu

AU - Fukushima, Takafumi

PY - 2019/4

Y1 - 2019/4

N2 - A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.

AB - A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.

KW - FHE

KW - FOWLP

KW - Stress Buffer Layer

UR - http://www.scopus.com/inward/record.url?scp=85068336046&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85068336046&partnerID=8YFLogxK

U2 - 10.23919/ICEP.2019.8733416

DO - 10.23919/ICEP.2019.8733416

M3 - Conference contribution

AN - SCOPUS:85068336046

T3 - 2019 International Conference on Electronics Packaging, ICEP 2019

SP - 265

EP - 267

BT - 2019 International Conference on Electronics Packaging, ICEP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 International Conference on Electronics Packaging, ICEP 2019

Y2 - 17 April 2019 through 20 April 2019

ER -