@inproceedings{ae917a9fa7a047c98d234bf77308a79e,
title = "Mechanical Characterization of FOWLPBased Flexible Hybrid Electronics (FHE) for Biomedical Sensor Application",
abstract = "A new flexible hybrid electronics (FHE) approach is studied for integrating high-performance and scalable flexible systems at the wafer level. The unique structure is consisting of monocrystalline semiconductor dielets embedded in flexible substrates such as elastomers. Stress buffer layers (SBL) as a key material are inserted between inter-dielet wirings and the substrates to enhance wire reliability. The impact of the SBL properties on the bendability of the FHE systems is described in this work.",
keywords = "FHE, FOWLP, Stress Buffer Layer",
author = "Yuki Susumago and Achille Jacquemond and Noriyuki Takahashi and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima",
note = "Funding Information: This work was supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Pioneering).; 2019 International Conference on Electronics Packaging, ICEP 2019 ; Conference date: 17-04-2019 Through 20-04-2019",
year = "2019",
month = apr,
doi = "10.23919/ICEP.2019.8733416",
language = "English",
series = "2019 International Conference on Electronics Packaging, ICEP 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "265--267",
booktitle = "2019 International Conference on Electronics Packaging, ICEP 2019",
}