Mechanical Characterization of a Single Yeast Cell Using a Robot Integrated Microfluidic Chip

Di Chang, Shinya Sakuma, Chihiro Uehara, Nobuyuki Uozumi, Fumihito Arai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports the evaluation results of Young's modulus of single Yeast cell (BY4741). We compared the Young's modulus of wild type and mutant type (ΔCCW12) using our constructed system. The system consists of a robot integrated microfluidic chip and a microscope with an optical tweezers system. The Young's modulus is measured by compressing the cell and measuring cellular reactive force. We succeeded in measuring wild type cells and mutant cells and compared their difference.

Original languageEnglish
Title of host publicationMHS 2018 - 2018 29th International Symposium on Micro-NanoMechatronics and Human Science
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538667927
DOIs
Publication statusPublished - 2018 Dec
Event29th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2018 - Nagoya, Japan
Duration: 2018 Dec 102018 Dec 12

Publication series

NameMHS 2018 - 2018 29th International Symposium on Micro-NanoMechatronics and Human Science

Conference

Conference29th International Symposium on Micro-NanoMechatronics and Human Science, MHS 2018
CountryJapan
CityNagoya
Period18/12/1018/12/12

ASJC Scopus subject areas

  • Human-Computer Interaction
  • Artificial Intelligence
  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Control and Optimization
  • Instrumentation

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  • Cite this

    Chang, D., Sakuma, S., Uehara, C., Uozumi, N., & Arai, F. (2018). Mechanical Characterization of a Single Yeast Cell Using a Robot Integrated Microfluidic Chip. In MHS 2018 - 2018 29th International Symposium on Micro-NanoMechatronics and Human Science [8886914] (MHS 2018 - 2018 29th International Symposium on Micro-NanoMechatronics and Human Science). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MHS.2018.8886914