Mechanical and electrical reliability of copper interconnections for 3DIC

Naoki Saito; Naokazu Murata; Kinji Tamakawa; Ken Suzuki; Hideo Miura

doi:10.1109/3DIC.2012.6262998

Mechanical and electrical reliability of copper interconnections for 3DIC

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

ENG - Fracture and Reliability Research Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.

Original language	English
Title of host publication	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs	https://doi.org/10.1109/3DIC.2012.6262998
Publication status	Published - 2011 Dec 1
Event	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan Duration: 2012 Jan 31 → 2012 Feb 2

Other

Other	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Country/Territory	Japan
City	Osaka
Period	12/1/31 → 12/2/2

ASJC Scopus subject areas

Control and Systems Engineering

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10.1109/3DIC.2012.6262998

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@inproceedings{77c37a4d91b444658882c63fb62ecaed,

title = "Mechanical and electrical reliability of copper interconnections for 3DIC",

abstract = "The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.",

author = "Naoki Saito and Naokazu Murata and Kinji Tamakawa and Ken Suzuki and Hideo Miura",

year = "2011",

month = dec,

day = "1",

doi = "10.1109/3DIC.2012.6262998",

language = "English",

isbn = "9781467321891",

booktitle = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

note = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 ; Conference date: 31-01-2012 Through 02-02-2012",

}

TY - GEN

T1 - Mechanical and electrical reliability of copper interconnections for 3DIC

AU - Saito, Naoki

AU - Murata, Naokazu

AU - Tamakawa, Kinji

AU - Suzuki, Ken

AU - Miura, Hideo

PY - 2011/12/1

Y1 - 2011/12/1

N2 - The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.

AB - The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.

UR - http://www.scopus.com/inward/record.url?scp=84866858208&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866858208&partnerID=8YFLogxK

U2 - 10.1109/3DIC.2012.6262998

DO - 10.1109/3DIC.2012.6262998

M3 - Conference contribution

AN - SCOPUS:84866858208

SN - 9781467321891

BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Y2 - 31 January 2012 through 2 February 2012

ER -

Mechanical and electrical reliability of copper interconnections for 3DIC

Abstract

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