Abstract
The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.
Original language | English |
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Title of host publication | 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 |
DOIs | |
Publication status | Published - 2011 Dec 1 |
Event | 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan Duration: 2012 Jan 31 → 2012 Feb 2 |
Other
Other | 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 |
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Country | Japan |
City | Osaka |
Period | 12/1/31 → 12/2/2 |
ASJC Scopus subject areas
- Control and Systems Engineering