Mechanical and electrical reliability of copper interconnections for 3DIC

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
Duration: 2012 Jan 312012 Feb 2

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period12/1/3112/2/2

ASJC Scopus subject areas

  • Control and Systems Engineering

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