Mechanical and electrical characterization of FOWLP-based flexible hybrid electronics (FHE) for biomedical sensor application

Yuki Susumago, Qian Zhengyang, Achille Jacquemond, Noriyuki Takahashi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A new flexible trans-nail photoplethysmographic (PPG) sensor system is proposed and characterized from both aspects of mechanical and electrical properties in this study. The unique FHE (flexible hybrid electronics) structure is consisting of an elastomer as a flexible substrate in which Si LSI dielets having photodiode and LED driver circuits etc. are embedded based on a FOWLP concept. Stress buffer layers (SBLs) as a key material are inserted between interdielet wirings and the substrate to mitigate mechanical stress and enhance wire reliability. The impact of the Young's moduli of the SBLs on the repeated bendability of the FHE systems is described. In addition, we evaluate the electrical properties of the photodiode circuits between before and after bending for comparison.

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages264-269
Number of pages6
ISBN (Electronic)9781728114989
DOIs
Publication statusPublished - 2019 May
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 2019 May 282019 May 31

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2019-May
ISSN (Print)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period19/5/2819/5/31

Keywords

  • Bendable interconnect
  • Biocompatible
  • FOWLP
  • Flexible hybrid electronics (FHE)
  • Metallization on PDMS
  • Trans-nail PPG sensor

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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