TY - GEN
T1 - Mechanical and electrical characterization of FOWLP-based flexible hybrid electronics (FHE) for biomedical sensor application
AU - Susumago, Yuki
AU - Zhengyang, Qian
AU - Jacquemond, Achille
AU - Takahashi, Noriyuki
AU - Kino, Hisashi
AU - Tanaka, Tetsu
AU - Fukushima, Takafumi
N1 - Funding Information:
This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. This work was supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Pioneering). We would like to acknowledge Toshiba Digital Solutions Corporation for 3Dprinted nail chip fabrication by OpenNail? technologies. We wish also to thank Nippon Polytech Corp. R&D Department for their matrial supports.
Funding Information:
Acknowledgement This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. This work was supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Pioneering). We would like to acknowledge Toshiba Digital Solutions Corporation for 3D-printed nail chip fabrication by OpenNail® technologies. We wish also to thank Nippon Polytech Corp. R&D Department for their matrial supports.
PY - 2019/5
Y1 - 2019/5
N2 - A new flexible trans-nail photoplethysmographic (PPG) sensor system is proposed and characterized from both aspects of mechanical and electrical properties in this study. The unique FHE (flexible hybrid electronics) structure is consisting of an elastomer as a flexible substrate in which Si LSI dielets having photodiode and LED driver circuits etc. are embedded based on a FOWLP concept. Stress buffer layers (SBLs) as a key material are inserted between interdielet wirings and the substrate to mitigate mechanical stress and enhance wire reliability. The impact of the Young's moduli of the SBLs on the repeated bendability of the FHE systems is described. In addition, we evaluate the electrical properties of the photodiode circuits between before and after bending for comparison.
AB - A new flexible trans-nail photoplethysmographic (PPG) sensor system is proposed and characterized from both aspects of mechanical and electrical properties in this study. The unique FHE (flexible hybrid electronics) structure is consisting of an elastomer as a flexible substrate in which Si LSI dielets having photodiode and LED driver circuits etc. are embedded based on a FOWLP concept. Stress buffer layers (SBLs) as a key material are inserted between interdielet wirings and the substrate to mitigate mechanical stress and enhance wire reliability. The impact of the Young's moduli of the SBLs on the repeated bendability of the FHE systems is described. In addition, we evaluate the electrical properties of the photodiode circuits between before and after bending for comparison.
KW - Bendable interconnect
KW - Biocompatible
KW - FOWLP
KW - Flexible hybrid electronics (FHE)
KW - Metallization on PDMS
KW - Trans-nail PPG sensor
UR - http://www.scopus.com/inward/record.url?scp=85072301164&partnerID=8YFLogxK
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U2 - 10.1109/ECTC.2019.00046
DO - 10.1109/ECTC.2019.00046
M3 - Conference contribution
AN - SCOPUS:85072301164
T3 - Proceedings - Electronic Components and Technology Conference
SP - 264
EP - 269
BT - Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 69th IEEE Electronic Components and Technology Conference, ECTC 2019
Y2 - 28 May 2019 through 31 May 2019
ER -