Measurements and simulation of substrate noise coupling in RF ICs with CMOS digital noise emulator

N. Azuma, S. Shimazaki, N. Miura, M. Nagata, T. Kitamura, S. Takahashi, M. Murakami, K. Hori, A. Nakamura, K. Tsukamoto, M. Iwanami, E. Hankui, Sho Muroga, Y. Endo, Satoshi Tanaka, M. Yamaguchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

Substrate noise coupling in RF receiver front end circuitry for LTE wireless communication was examined by full-chip level simulation and on-chip measurements, with a demonstrator built in a 65 nm CMOS technology. A complete simulation flow of full-chip level substrate noise coupling uses a decoupled modeling approach, where substrate noise waveforms drawn with a unified package-chip model of noise source circuits are given to mixed-level simulation of RF chains as noise sensitive circuits. The distribution of substrate noise in a chip and the attenuation with distance are simulated and compare with the measurements. The interference of substrate noise at the 17th harmonics of 124.8 MHz - the operating frequency of the CMOS noise emulator creates spurious tones in the communication bandwidth at 2.1 GHz.

Original languageEnglish
Title of host publicationEMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits
PublisherIEEE Computer Society
Pages42-46
Number of pages5
ISBN (Print)9781479923151
DOIs
Publication statusPublished - 2013 Jan 1
Event9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2013 - Nara, Japan
Duration: 2013 Dec 152013 Dec 18

Publication series

NameEMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits

Other

Other9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2013
CountryJapan
CityNara
Period13/12/1513/12/18

Keywords

  • Noise interference
  • Power delivery network
  • Substrate coupling
  • Wireless communication

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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