Measurement of the residual stress distribution in the 3D-stacked electronic modules by embedded strain sensors

Ryota Mizuno, Genta Nakauchi, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, micro-scale strain sensors were embedded in a silicon chip to measure the variation of the local stress distribution around thin film interconnections used for 3D semiconductor modules. Piezoresistive effect of single crystal silicon was applied to the sensors. The stress sensitivity at room temperature was 1.3 MPa/Ω. Even though the stress sensitivity varied as a strong function of temperature, it was confirmed that this sensor can measure the stress distribution quantitatively in the temperature range from room temperature to 8°C at most. And the variation of the residual stress in electroplated copper thin films during heat treatment was investigated from the viewpoint of the change of stress amplitude during a thermal cycle. From the obtained results, it was confirmed that the recrystallization occurred when the films were annealed at only 200°C, and the change of the micro textue of the films caused the change of their residual stress. Therefore, it is very important to control the micro texture during electroplating for assuring long term reliability of interconnections.

Original languageEnglish
Title of host publicationMicro- and Nano-Systems Engineering and Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791859476
DOIs
Publication statusPublished - 2019 Jan 1
EventASME 2019 International Mechanical Engineering Congress and Exposition, IMECE 2019 - Salt Lake City, United States
Duration: 2019 Nov 112019 Nov 14

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume10

Conference

ConferenceASME 2019 International Mechanical Engineering Congress and Exposition, IMECE 2019
CountryUnited States
CitySalt Lake City
Period19/11/1119/11/14

Keywords

  • Electroplated copper
  • Piezoresistive effect of silicon
  • Residual stress
  • Strain sensor
  • Thin film interconnection

ASJC Scopus subject areas

  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Measurement of the residual stress distribution in the 3D-stacked electronic modules by embedded strain sensors'. Together they form a unique fingerprint.

Cite this