Measurement of local residual stress of a flip chip structure using a stress sensing chip

Nobuki Ueta, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

Local residual stress at a surface of a silicon chip mounted on a substrate using flip chip technology was measured using a stress sensor chip that was composed of 168 strain gauges of 10-μm in length. Each strain gauge was made of polycrystalline silicon films deposited on a silicon wafer. The periodic stress distribution was measured at a surface of the sensor chip between two bumps. Five gauges were aligned at a interval of 20-μm between the bumps. When the thickness of the chip was less than 200 μm, the amplitude of the stress increased drastically, as was predicted by a finite element analysis. The amplitude of the stress reached about 150 MPa, when the thickness of the chip was thinned to 50 μm. The amplitude of the stress is a strong function of the thickness of a silicon chip and the intervals of the bumps.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
PublisherAmerican Society of Mechanical Engineers
Pages1135-1140
Number of pages6
ISBN (Print)0791842002, 9780791842003
DOIs
Publication statusPublished - 2005
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 2005 Jul 172005 Jul 22

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART B

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period05/7/1705/7/22

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Ueta, N., & Miura, H. (2005). Measurement of local residual stress of a flip chip structure using a stress sensing chip. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1135-1140). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART B). American Society of Mechanical Engineers. https://doi.org/10.1115/ipack2005-73112