Measurement of adhesion strength of solid-state diffusion bonding between nickel and copper by means of laser shock spallation method

M. Satou, H. Akamatsu, A. Hasegawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Measurement of adhesion strength of solid-state diffusion bonding between nickel and copper by means of laser shock spallation method'. Together they form a unique fingerprint.

Physics & Astronomy