Measurement of adhesion strength of solid-state diffusion bonding between nickel and copper by means of laser shock spallation method

M. Satou, H. Akamatsu, A. Hasegawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Coating and bonding techniques between different materials are essential to the field of technology. Bond mechanism is of interest from scientific point of view. A well-established method to make bonding between unalloyed nickel and copper was utilized, that was solid-state diffusion bonding at elevated temperatures. Irradiation by Nd:YAG laser with 7ns-pulse width created shock wave that caused tensile stress after reflection at free surface. The adhesion strength was determined by the critical laser power that caused exfoliation of the bonding interface.

Original languageEnglish
Title of host publicationShock Compression of Condensed Matter - 2009 - Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter
Pages1131-1134
Number of pages4
DOIs
Publication statusPublished - 2009 Dec 1
EventConference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2009 APS SCCM - Nashville, TN, United States
Duration: 2009 Jun 282009 Jul 3

Publication series

NameAIP Conference Proceedings
Volume1195
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

OtherConference of the American Physical Society Topical Group on Shock Compression of Condensed Matter, 2009 APS SCCM
CountryUnited States
CityNashville, TN
Period09/6/2809/7/3

Keywords

  • Adhesive strength
  • Bonding
  • Interface
  • Laser shock spallation

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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    Satou, M., Akamatsu, H., & Hasegawa, A. (2009). Measurement of adhesion strength of solid-state diffusion bonding between nickel and copper by means of laser shock spallation method. In Shock Compression of Condensed Matter - 2009 - Proceedings of the Conference of the American Physical Society Topical Group on Shock Compression of Condensed Matter (pp. 1131-1134). (AIP Conference Proceedings; Vol. 1195). https://doi.org/10.1063/1.3295001