Measurement and Analysis of Seismic Response in Semiconductor Manufacturing Equipment

Kaori Komoda, Masashi Sakuma, Masakazu Yata, Yoshio Yamazaki, Fuminobu Imaizumi, Rihito Kuroda, Shigetoshi Sugawa

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, a cost-effective, easy-install and fast measurement and analysis method to obtain seismic response of semiconductor manufacturing equipments was developed and its validity was discussed. In the developed method, micro-vibration measurement experiments are first carried out to obtain transfer functions and coherence functions from the floor to arbitrary part of equipment. Using obtained transfer function, seismic response of the arbitrary part of equipment is analyzed with seismic floor response input. In this paper, the developed method was applied to a vertical furnace and a lithography system and their transfer functions were experimentally obtained. It has been confirmed that with additional excitation on the floor near the equipment is effective to improve the accuracy of obtained transfer functions. The validity of developed analysis method was confirmed by the good agreement between the analytical result and the experimental result obtained with a shaking table. The developed method is to be useful to estimate seismic damage of various types of semiconductor manufacturing equipment as well as to take seismic countermeasures.

Original languageEnglish
Article number7097718
Pages (from-to)289-296
Number of pages8
JournalIEEE Transactions on Semiconductor Manufacturing
Volume28
Issue number3
DOIs
Publication statusPublished - 2015 Aug 1

Keywords

  • Earthquakes
  • Signal analysis
  • Transfer functions
  • semiconductor device manufacture

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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