Manipulation of thin metallic wires by Joule heat joining

Hironori Tohmyoh, Hironao Takeda, M. A. Salam Akanda, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Various kinds of metallic thin wires are expected to be key elements in future NEMS or MEMS due to their excellent physical properties and geometrical merits. However, it is not so easy task to manipulate thin wires for many kinds of application nowadays. We report manipulation techniques based on weld-joining on a substrate by Joule heating. The Pt thin wires with the diameter of about 625 nm were welded onto In wires as substrates. The Pt wires on the In substrate were taken for the three-point bending test and potential drop test for determining their mechanical and electrical properties. Moreover, based on the manipulation technique, by twisting the Pt thin wire around a core wire, simply-supported micro-coils on electrode chips were successfully fabricated, and their utility as electromagnetic actuators was realized.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Number of pages5
Publication statusPublished - 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: 2009 Jul 192009 Jul 23

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009


Other2009 ASME InterPack Conference, IPACK2009
Country/TerritoryUnited States
CitySan Francisco, CA

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering


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