Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels

Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata, Akihiro Takahashi, Yasunori Miyazawa, Masahiro Yamaguchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Magnetic composite sheets of ferrite powders suppressed the undesired RF electromagnetic noise emission in a flip-chip semiconductor IC chip package. Their effects were evaluated by the measurements with Si demonstrators and the improvements on wireless communication performance were simulated at the wireless system level. The effectiveness was found to be dependent on the composites - BaZn-Y hexagonal ferrites exhibited noise suppression by 7dB, which corresponded to the wireless performance improvements by 8dB in the 800 MHz band when the long term evolution (LTE) wireless system is assumed.

Original languageEnglish
Title of host publicationEMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages219-221
Number of pages3
ISBN (Electronic)9781728142616
DOIs
Publication statusPublished - 2019 Oct
Event12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 - Haining, Hangzhou, China
Duration: 2019 Oct 212019 Oct 23

Publication series

NameEMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Conference

Conference12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019
CountryChina
CityHaining, Hangzhou
Period19/10/2119/10/23

Keywords

  • Magnetic material
  • Noise coupling
  • Noise emission
  • Semiconductor integrated circuits
  • Wireless communication

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Radiation

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