Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels

Koh Watanabe; Kosuke Jike; Satoshi Tanaka; Noriyuki Miura; Makoto Nagata; Akihiro Takahashi; Yasunori Miyazawa; Masahiro Yamaguchi

doi:10.1109/EMCCompo.2019.8919937

Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels

Koh Watanabe, Kosuke Jike, Satoshi Tanaka, Noriyuki Miura, Makoto Nagata, Akihiro Takahashi, Yasunori Miyazawa, Masahiro Yamaguchi

ENG - Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Magnetic composite sheets of ferrite powders suppressed the undesired RF electromagnetic noise emission in a flip-chip semiconductor IC chip package. Their effects were evaluated by the measurements with Si demonstrators and the improvements on wireless communication performance were simulated at the wireless system level. The effectiveness was found to be dependent on the composites - BaZn-Y hexagonal ferrites exhibited noise suppression by 7dB, which corresponded to the wireless performance improvements by 8dB in the 800 MHz band when the long term evolution (LTE) wireless system is assumed.

Original language	English
Title of host publication	EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	219-221
Number of pages	3
ISBN (Electronic)	9781728142616
DOIs	https://doi.org/10.1109/EMCCompo.2019.8919937
Publication status	Published - 2019 Oct
Event	12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019 - Haining, Hangzhou, China Duration: 2019 Oct 21 → 2019 Oct 23

Publication series

Name	EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits

Conference

Conference	12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019
Country	China
City	Haining, Hangzhou
Period	19/10/21 → 19/10/23

Keywords

Magnetic material
Noise coupling
Noise emission
Semiconductor integrated circuits
Wireless communication

ASJC Scopus subject areas

Instrumentation
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Radiation

Access to Document

10.1109/EMCCompo.2019.8919937

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Watanabe, K., Jike, K., Tanaka, S., Miura, N., Nagata, M., Takahashi, A., Miyazawa, Y., & Yamaguchi, M. (2019). Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels. In EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (pp. 219-221). [8919937] (EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMCCompo.2019.8919937

Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels. / Watanabe, Koh; Jike, Kosuke; Tanaka, Satoshi; Miura, Noriyuki; Nagata, Makoto; Takahashi, Akihiro; Miyazawa, Yasunori; Yamaguchi, Masahiro.

EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc., 2019. p. 219-221 8919937 (EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Watanabe, K, Jike, K, Tanaka, S, Miura, N, Nagata, M, Takahashi, A, Miyazawa, Y & Yamaguchi, M 2019, Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels. in EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits., 8919937, EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, Institute of Electrical and Electronics Engineers Inc., pp. 219-221, 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019, Haining, Hangzhou, China, 19/10/21. https://doi.org/10.1109/EMCCompo.2019.8919937

Watanabe K, Jike K, Tanaka S, Miura N, Nagata M, Takahashi A et al. Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels. In EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc. 2019. p. 219-221. 8919937. (EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits). https://doi.org/10.1109/EMCCompo.2019.8919937

Watanabe, Koh ; Jike, Kosuke ; Tanaka, Satoshi ; Miura, Noriyuki ; Nagata, Makoto ; Takahashi, Akihiro ; Miyazawa, Yasunori ; Yamaguchi, Masahiro. / Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels. EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 219-221 (EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits).

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title = "Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels",

abstract = "Magnetic composite sheets of ferrite powders suppressed the undesired RF electromagnetic noise emission in a flip-chip semiconductor IC chip package. Their effects were evaluated by the measurements with Si demonstrators and the improvements on wireless communication performance were simulated at the wireless system level. The effectiveness was found to be dependent on the composites - BaZn-Y hexagonal ferrites exhibited noise suppression by 7dB, which corresponded to the wireless performance improvements by 8dB in the 800 MHz band when the long term evolution (LTE) wireless system is assumed.",

keywords = "Magnetic material, Noise coupling, Noise emission, Semiconductor integrated circuits, Wireless communication",

author = "Koh Watanabe and Kosuke Jike and Satoshi Tanaka and Noriyuki Miura and Makoto Nagata and Akihiro Takahashi and Yasunori Miyazawa and Masahiro Yamaguchi",

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AU - Nagata, Makoto

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