TY - GEN
T1 - Magnetic Composite Sheets in IC Chip Packaging for Suppression of Undesired Noise Emission to Wireless Communication Channels
AU - Watanabe, Koh
AU - Jike, Kosuke
AU - Tanaka, Satoshi
AU - Miura, Noriyuki
AU - Nagata, Makoto
AU - Takahashi, Akihiro
AU - Miyazawa, Yasunori
AU - Yamaguchi, Masahiro
N1 - Funding Information:
ACKNOWLEDGMENTS The authors thank M. Sato of NICHe, Tohoku University, Sendai, Japan, for development of the magnetic composite sheet. This work was supported in part by Development of Technical Examination Services Concerning Frequency Crowding, Ministry of Internal Affairs and Communications, Japan
Publisher Copyright:
© 2019 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - Magnetic composite sheets of ferrite powders suppressed the undesired RF electromagnetic noise emission in a flip-chip semiconductor IC chip package. Their effects were evaluated by the measurements with Si demonstrators and the improvements on wireless communication performance were simulated at the wireless system level. The effectiveness was found to be dependent on the composites - BaZn-Y hexagonal ferrites exhibited noise suppression by 7dB, which corresponded to the wireless performance improvements by 8dB in the 800 MHz band when the long term evolution (LTE) wireless system is assumed.
AB - Magnetic composite sheets of ferrite powders suppressed the undesired RF electromagnetic noise emission in a flip-chip semiconductor IC chip package. Their effects were evaluated by the measurements with Si demonstrators and the improvements on wireless communication performance were simulated at the wireless system level. The effectiveness was found to be dependent on the composites - BaZn-Y hexagonal ferrites exhibited noise suppression by 7dB, which corresponded to the wireless performance improvements by 8dB in the 800 MHz band when the long term evolution (LTE) wireless system is assumed.
KW - Magnetic material
KW - Noise coupling
KW - Noise emission
KW - Semiconductor integrated circuits
KW - Wireless communication
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U2 - 10.1109/EMCCompo.2019.8919937
DO - 10.1109/EMCCompo.2019.8919937
M3 - Conference contribution
AN - SCOPUS:85077962131
T3 - EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
SP - 219
EP - 221
BT - EMC COMPO 2019 - 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019
Y2 - 21 October 2019 through 23 October 2019
ER -