Macroporous silicon-based deep anisotropic etching

Yi Tao, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

A novel micromachining technique for silicon deep anisotropic etching using macroporous silicon is developed. Macroporous silicon is formed selectively in n-type substrates using silicon anodization in a hydrofluoric acid (HF)-based electrolyte with backside illumination. Three-dimensional microstructures are fabricated by removing the macroporous silicon in alkali solutions. This technique enables us to etch (100) n-type silicon with arbitrary shaped windows to produce high-aspect-ratio structures with vertical sidewalls using a wet etching process.

Original languageEnglish
Pages (from-to)764-770
Number of pages7
JournalJournal of Micromechanics and Microengineering
Volume15
Issue number4
DOIs
Publication statusPublished - 2005 Apr 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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