A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10-6 Ω m). This novel process may open a new strategy in the field of printed electronics.
ASJC Scopus subject areas
- Chemical Engineering(all)