Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu2+-alkanolamine metallacycle compounds for electrically conductive layer formation

Tetsu Yonezawa, Hiroki Tsukamoto, Yingqiong Yong, Mai Thanh Nguyen, Masaki Matsubara

Research output: Contribution to journalArticle

34 Citations (Scopus)

Abstract

A novel low cost sintering process of copper fine particles to a copper conductive layer was demonstrated at as low as 100 °C without reductive gas flow. Sintering of a mixture of copper particles and copper-based metal-organic-decomposition (MOD) ink gave a copper film with high packing density and low resistivity (9 × 10-6 Ω m). This novel process may open a new strategy in the field of printed electronics.

Original languageEnglish
Pages (from-to)12048-12052
Number of pages5
JournalRSC Advances
Volume6
Issue number15
DOIs
Publication statusPublished - 2016 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Chemistry(all)
  • Chemical Engineering(all)

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