Low temperature metal interdiffusion bonding for micro devices

J. Fromel, Y. C. Lin, M. Wiemer, T. Gessner, M. Esashi

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    We demonstrate solid liquid interdiffusion bonding by gallium and gold as bonding material and show the bonding at 40°C. Because of the low melting point of gallium of 29.8°C several difficulties for processing the gallium exists. We could successful develop deposition, structuring and bonding processes.

    Original languageEnglish
    Title of host publicationProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
    Pages163
    Number of pages1
    DOIs
    Publication statusPublished - 2012
    Event2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan
    Duration: 2012 May 222012 May 23

    Publication series

    NameProceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

    Other

    Other2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
    Country/TerritoryJapan
    CityTokyo
    Period12/5/2212/5/23

    ASJC Scopus subject areas

    • Computer Graphics and Computer-Aided Design
    • Computer Vision and Pattern Recognition

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