Abstract
We demonstrate solid liquid interdiffusion bonding by gallium and gold as bonding material and show the bonding at 40°C. Because of the low melting point of gallium of 29.8°C several difficulties for processing the gallium exists. We could successful develop deposition, structuring and bonding processes.
Original language | English |
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Title of host publication | Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 |
Number of pages | 1 |
DOIs | |
Publication status | Published - 2012 Aug 15 |
Event | 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: 2012 May 22 → 2012 May 23 |
Other
Other | 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 |
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Country | Japan |
City | Tokyo |
Period | 12/5/22 → 12/5/23 |
ASJC Scopus subject areas
- Computer Graphics and Computer-Aided Design
- Computer Vision and Pattern Recognition