Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging

Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

Hermetic packaging plays an important role for optimizing the functionality and reliability of a wide variety of micro-electro-mechanical systems (MEMS). In this paper, we propose a low-temperature wafer-level hermetic packaging method based on the thermo-compression bonding process using an electroplated Cu sealing frame planarized by a single-point diamond mechanical fly-cutting. This technology has an inherent possibility of hermetic sealing and electrical contact as well as a capability of integration of micro-structured wafers. Hermetic sealing can be realized with the sealing frame as narrow as 30 μm at a temperature as low as 250 °C. At such a low bonding temperature, a less amount of gases is desorbed, resulting in a sealed cavity pressure lower than 100 Pa. The leak rate into the packages is estimated by a long-term sealed cavity pressure measurement for 7 months to be less than 1.67 × 10−15 Pa m3 s−1. In addition, the bonding shear strength is also evaluated to be higher than 100 MPa.

Original languageEnglish
Pages (from-to)671-679
Number of pages9
JournalSensors and Actuators, A: Physical
Volume279
DOIs
Publication statusPublished - 2018 Aug 15

Keywords

  • Cu–Cu thermo-compression bonding
  • Heterogeneous integration
  • Single-point diamond fly-cutting
  • Wafer-level hermetic packaging

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging'. Together they form a unique fingerprint.

Cite this