Low temperature bonding of bulk metallic glass using an ultrasonic process

Hiroshi Nishikawa, Krit Wong Piromsarn, Hiroya Abe, Tadashi Takemoto, Masao Kubo, Yoshiharu Sanagawa, Takamasa Sakai, Mikio Fukuhara, Akihisa Inoue

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

For bulk metallic glasses (BMGs) to be adopted over a broader range of engineering applications, it is imperative to develop appropriate bonding processes for BMG/BMG and BMG/crystalline metal. The glass transition temperature and crystallization temperature of BMGs are relatively low. Therefore, to avoid the recrystallization of the glassy phase during bonding, low-temperature processes such as common soldering and ultrasonic wedge bonding process have been studied. The purpose of this study is to determine the feasibility of ultrasonic A1 wire wedge bonding on Cu-, Ni-, and Zr-based BMGs. We achieved the bonding of A1 wire to BMGs at ambient temperatures, and it was found that the interfaces are straight and sharp without any visible intermetallic compound layers under conventional magnifications of a scanning electron microscope.

Original languageEnglish
Title of host publicationCharacterization and Control of Interfaces for High Quality Advanced Materials III - Proc. 3rd Int. Conf. on Characterization and Control of Interfaces for High Quality Advanced Materials,ICCCI2009
PublisherAmerican Ceramic Society
Pages29-35
Number of pages7
ISBN (Print)9780470909171
DOIs
Publication statusPublished - 2010
Event3rd International Conference on Characterization and Control of Interfaces for High Quality Advanced Materials, ICCCI2009 - Kurashiki, Japan
Duration: 2009 Sep 62009 Sep 9

Publication series

NameCeramic Transactions
Volume219
ISSN (Print)1042-1122

Other

Other3rd International Conference on Characterization and Control of Interfaces for High Quality Advanced Materials, ICCCI2009
CountryJapan
CityKurashiki
Period09/9/609/9/9

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

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