Low-resistance Cu-Sn electroplated-evaporated microbumps for 3D chip stacking

M. Murugesan, Y. Ohara, T. Fukushima, T. Tanaka, M. Koyanagi

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Low-resistance Cu-Sn electroplated-evaporated microbumps for 3D chip stacking'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds