Low-energy focused-ion-beam shape observation and its noise reduction for nanofabrication

M. Itoh, Y. Hirayama, S. Tarucha

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Two types of noise from the variable landing-energy focused-ion-beam (FIB) system appeared when FIB was line-scanned on an n-GaAs wafer and implantation-induced damage was estimated by using selective etching and secondary electron microscope (SEM) observation. The first had a rough surface with small craters away from implanted lines and the second had clearly observable scratchiness along implanted lines. Cathode luminescence measurement and auger analysis were performed to estimate beam-tail spreading. Both the long-beam-tail and the scratchy noise probably originated from unintentionally scattered beams in the ion-beam lens column and/or neutral particles emitted from the liquid metal ion source. As a result, these noises could be greatly reduced by locating a new aperture at an appropriate position. Using this refined FIB system, low landing-energy-ion-beams should be able to be applied to fabricate high-quality mesoscopic devices.

Original languageEnglish
Pages (from-to)21-34
Number of pages14
JournalMicroelectronic Engineering
Volume40
Issue number1
DOIs
Publication statusPublished - 1998 Feb 1
Externally publishedYes

Keywords

  • Aperture
  • FIB
  • Implantation-induced damage
  • Lens column
  • Mesoscopic devices
  • Noise

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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