TY - GEN
T1 - Low Delay 4K 120fps HEVC Decoder with Parallel Processing Architecture
AU - Nakamura, Ken
AU - Omori, Yuya
AU - Kobayashi, Daisuke
AU - Osawa, Tatsuya
AU - Onishi, Takayuki
AU - Nitta, Koyo
AU - Iwasaki, Hiroe
AU - Shimizu, Atsushi
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/5/23
Y1 - 2019/5/23
N2 - This paper describes a novel low delay 4K 120fps real-time HEVC decoder we have developed with parallel processing architecture that conforms to the HEVC Main 4:2:2 10 profile. It supports the temporal scalable streams required for 4K high frame rate broadcasting and also supports low delay and high bitrate decoding for video transmission. To achieve this support, the decoding processes are parallelized and pipelined at frame level, slice level and Coding Tree Unit row level. The proposed decoder is implemented on three Arria10 series FPGAs operating at 133 and 150MHz, and achieves 300Mbps stream decoding and 37msec end-to-end delay with our concurrently developed 4K 120fps encoder.
AB - This paper describes a novel low delay 4K 120fps real-time HEVC decoder we have developed with parallel processing architecture that conforms to the HEVC Main 4:2:2 10 profile. It supports the temporal scalable streams required for 4K high frame rate broadcasting and also supports low delay and high bitrate decoding for video transmission. To achieve this support, the decoding processes are parallelized and pipelined at frame level, slice level and Coding Tree Unit row level. The proposed decoder is implemented on three Arria10 series FPGAs operating at 133 and 150MHz, and achieves 300Mbps stream decoding and 37msec end-to-end delay with our concurrently developed 4K 120fps encoder.
KW - 4K
KW - Decoder
KW - HEVC
KW - High frame rate
KW - Temporal scalability
UR - http://www.scopus.com/inward/record.url?scp=85067131428&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85067131428&partnerID=8YFLogxK
U2 - 10.1109/CoolChips.2019.8721335
DO - 10.1109/CoolChips.2019.8721335
M3 - Conference contribution
AN - SCOPUS:85067131428
T3 - IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings
BT - IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd IEEE Symposium on Low-Power and High-Speed Chips and Systems, COOL CHIPS 2019
Y2 - 17 April 2019 through 19 April 2019
ER -