Local misorientation change along grain boundary in coarse-grained YBa2Cu3O7-x prepared by melt-texturing process

Shinichi Yamaura; K. Nakashio; Y. Igarashi; T. Watanabe

doi:10.1016/S1359-6462(97)00085-7

Local misorientation change along grain boundary in coarse-grained YBa₂Cu₃O_7-x prepared by melt-texturing process

Shinichi Yamaura, K. Nakashio, Y. Igarashi, T. Watanabe

Research output: Contribution to journal › Article › peer-review

Abstract

The present investigation has revealed that the misorientation angle can change locally and systematically along a grain boundary due to the interaction with sub-boundaries in coarse-grained YBCO grown by the MPMG process. More detailed analysis of grain boundary character is required for engineering grain boundaries in superconducting polycrystalline YBCO.

Original language	English
Pages (from-to)	141-145
Number of pages	5
Journal	Scripta Materialia
Volume	37
Issue number	2
DOIs	https://doi.org/10.1016/S1359-6462(97)00085-7
Publication status	Published - 1997 Jul 15

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Access to Document

10.1016/S1359-6462(97)00085-7

Fingerprint Dive into the research topics of 'Local misorientation change along grain boundary in coarse-grained YBa2Cu3O7-x prepared by melt-texturing process'. Together they form a unique fingerprint.

Cite this

@article{d8757f9bdd75498a9a17cbccf142a569,

title = "Local misorientation change along grain boundary in coarse-grained YBa2Cu3O7-x prepared by melt-texturing process",

abstract = "The present investigation has revealed that the misorientation angle can change locally and systematically along a grain boundary due to the interaction with sub-boundaries in coarse-grained YBCO grown by the MPMG process. More detailed analysis of grain boundary character is required for engineering grain boundaries in superconducting polycrystalline YBCO.",

author = "Shinichi Yamaura and K. Nakashio and Y. Igarashi and T. Watanabe",

year = "1997",

month = jul,

day = "15",

doi = "10.1016/S1359-6462(97)00085-7",

language = "English",

volume = "37",

pages = "141--145",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Elsevier Limited",

number = "2",

}

TY - JOUR

T1 - Local misorientation change along grain boundary in coarse-grained YBa2Cu3O7-x prepared by melt-texturing process

AU - Yamaura, Shinichi

AU - Nakashio, K.

AU - Igarashi, Y.

AU - Watanabe, T.

PY - 1997/7/15

Y1 - 1997/7/15

N2 - The present investigation has revealed that the misorientation angle can change locally and systematically along a grain boundary due to the interaction with sub-boundaries in coarse-grained YBCO grown by the MPMG process. More detailed analysis of grain boundary character is required for engineering grain boundaries in superconducting polycrystalline YBCO.

AB - The present investigation has revealed that the misorientation angle can change locally and systematically along a grain boundary due to the interaction with sub-boundaries in coarse-grained YBCO grown by the MPMG process. More detailed analysis of grain boundary character is required for engineering grain boundaries in superconducting polycrystalline YBCO.

UR - http://www.scopus.com/inward/record.url?scp=0041625955&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0041625955&partnerID=8YFLogxK

U2 - 10.1016/S1359-6462(97)00085-7

DO - 10.1016/S1359-6462(97)00085-7

M3 - Article

AN - SCOPUS:0041625955

VL - 37

SP - 141

EP - 145

JO - Scripta Materialia

JF - Scripta Materialia

SN - 1359-6462

IS - 2

ER -

Local misorientation change along grain boundary in coarse-grained YBa₂Cu₃O_7-x prepared by melt-texturing process

Abstract

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint Dive into the research topics of 'Local misorientation change along grain boundary in coarse-grained YBa<sub>2</sub>Cu<sub>3</sub>O<sub>7-x</sub> prepared by melt-texturing process'. Together they form a unique fingerprint.

Cite this