Loading of Soft Grade Wheels and Effects of Removal of Loading Chips —Studies on Creep Feed Grinding (6th Report)—

Seiki Matsui, Katsuo Shoji, Tsunemoto Kuriyagawa

Research output: Contribution to journalArticlepeer-review

Abstract

This paper describes the loading of soft grade wheel and effects of removal of loading chips on grinding performance. In creep feed grinding, chips are long, thin and curled. The chips loaded into wheel pores, therefore, are not removed easily, and are remained. Such loading chips have adversely effects upon the grinding performance. Soft grade wheel which is effective to prevent dulling has large pores, so that it seems that the wheel is effective to prevent loading, too. In this paper, loaded area rate which is the ratio of loaded area to wheel surface area is measured by reflected light intensity method in creep feed grinding with the soft grade wheel, and influence of wheel depth of cut and wheel grade on loaded area rate is clarified. For the improvement of grinding performance, furthermore, loading chips are removed with high pressure grinding fluid supply unit and specially-made nozzle. As a result of investigation, the followings became evident. (1) Loaded area rate increases with a rise in wheel depth of cut or wheel grade. (2) In the case of the soft grade wheel, removal of loading chips is effective in reducing a wheel wear, but is not effective in reducing a grinding force.

Original languageEnglish
Pages (from-to)743-748
Number of pages6
JournalJournal of the Japan Society for Precision Engineering
Volume54
Issue number4
DOIs
Publication statusPublished - 1988 Jan 1
Externally publishedYes

Keywords

  • creep feed grinding
  • high pressure grinding fluid supply unit
  • loaded area rate
  • loading
  • reflected light intensity
  • soft grade wheel
  • wheel pore

ASJC Scopus subject areas

  • Mechanical Engineering

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