Lithium niobate SAW device hetero-transferred onto silicon integrated circuit using elastic and sticky bumps

Shuji Tanaka, Masaki Yoshida, Hideki Hirano, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

In this study, a new process to temporarily integrate two components via an elastic and sticky silicone layer was developed. The developed integration process is as easy as contact photolithography and even reworkable, and thus will be useful for the quick test of hetro-integrated devices made of different materials of wafer. It was applied to integrated SAW oscillators with resonance frequencies of 400-600 MHz. LiNbO3-based SAW resonators supported by a glass wafer were transferred onto an IC wafer with CMOS sustaining amplifiers. A transfer yield of 96 % was obtained, while electrical interconnection was failed for two thirds of samples optimized process conditions to be optimized. The measured phase noise was comparable with that of the SAW oscillator integrated by Au-to-Au bonding.

Original languageEnglish
Title of host publication2012 IEEE International Ultrasonics Symposium, IUS 2012
Pages295-298
Number of pages4
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 IEEE International Ultrasonics Symposium, IUS 2012 - Dresden, Germany
Duration: 2012 Oct 72012 Oct 10

Publication series

NameIEEE International Ultrasonics Symposium, IUS
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Other

Other2012 IEEE International Ultrasonics Symposium, IUS 2012
CountryGermany
CityDresden
Period12/10/712/10/10

Keywords

  • Integration
  • Lithium niobate
  • Phase noise
  • SAW oscilaltor
  • Silicone

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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