Line-profile analysis combined with texture analysis for characterizing dislocation distribution in texture components of cold-rolled copper sheets

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1 Citation (Scopus)

Abstract

We described a newly developed characterization technique that dislocation density could be individually determined for each texture component of plastically deformed metals by combining the line-profile analysis with the texture analysis by using X-ray diffraction. This method was applied to major texture components of cube, copper, and brass evolved in cold-rolled copper sheets. The Warren-Averbach procedure using two diffraction peaks was used for estimating the dislocation density. An increase in the dislocation density with the rolling reduction was evaluated for individual texture components. Although the individual texture components underwent the different slip paths, the dislocation densities in these texture components were almost comparable; however, the non-texture component was shown to have a higher dislocation density than the texture components. The recovery and recrystallization proceeded preferentially in the non-texture component.

Original languageEnglish
Pages (from-to)705-713
Number of pages9
JournalHigh Temperature Materials and Processes
Volume35
Issue number7
DOIs
Publication statusPublished - 2016 Aug 1

Keywords

  • X-ray diffraction
  • copper
  • dislocation
  • line-profile analysis
  • recrystallization
  • texture

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Physical and Theoretical Chemistry

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