Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Asao Nishimura; Akihiro Tatemichi; Hideo Miura; Tatsuji Sakamoto

doi:10.1109/TCHMT.1987.1134777

Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Asao Nishimura, Akihiro Tatemichi, Hideo Miura, Tatsuji Sakamoto

Research output: Contribution to journal › Article › peer-review

47 Citations (Scopus)

Abstract

The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.

Original language	English
Pages (from-to)	637-642
Number of pages	6
Journal	IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume	10
Issue number	4
DOIs	https://doi.org/10.1109/TCHMT.1987.1134777
Publication status	Published - 1987 Dec
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Engineering(all)
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/TCHMT.1987.1134777

Cite this

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abstract = "The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.",

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AU - Sakamoto, Tatsuji

PY - 1987/12

Y1 - 1987/12

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AB - The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.

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Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Abstract

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