Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Asao Nishimura; Akihiro Tatemichi; Hideo Miura; Tatsuji Sakamoto

doi:10.1109/TCHMT.1987.1134777

Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Asao Nishimura, Akihiro Tatemichi, Hideo Miura, Tatsuji Sakamoto

Research output: Contribution to journal › Article › peer-review

46 Citations (Scopus)

Abstract

The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.

Original language	English
Pages (from-to)	637-642
Number of pages	6
Journal	IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume	10
Issue number	4
DOIs	https://doi.org/10.1109/TCHMT.1987.1134777
Publication status	Published - 1987 Dec
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Engineering(all)
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/TCHMT.1987.1134777

Fingerprint Dive into the research topics of 'Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics'. Together they form a unique fingerprint.

Cite this

@article{0b183c329fed4e0ba64854c921671aec,

title = "Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics",

abstract = "The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.",

author = "Asao Nishimura and Akihiro Tatemichi and Hideo Miura and Tatsuji Sakamoto",

year = "1987",

month = dec,

doi = "10.1109/TCHMT.1987.1134777",

language = "English",

volume = "10",

pages = "637--642",

journal = "IEEE Transactions on Components, Hybrids and Manufacturing Technology",

issn = "0148-6411",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

TY - JOUR

T1 - Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

AU - Nishimura, Asao

AU - Tatemichi, Akihiro

AU - Miura, Hideo

AU - Sakamoto, Tatsuji

PY - 1987/12

Y1 - 1987/12

N2 - The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.

AB - The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.

UR - http://www.scopus.com/inward/record.url?scp=0023560046&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0023560046&partnerID=8YFLogxK

U2 - 10.1109/TCHMT.1987.1134777

DO - 10.1109/TCHMT.1987.1134777

M3 - Article

AN - SCOPUS:0023560046

VL - 10

SP - 637

EP - 642

JO - IEEE Transactions on Components, Hybrids and Manufacturing Technology

JF - IEEE Transactions on Components, Hybrids and Manufacturing Technology

SN - 0148-6411

IS - 4

ER -

Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Abstract

ASJC Scopus subject areas

Access to Document

Other files and links

Cite this