Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics

Asao Nishimura, Akihiro Tatemichi, Hideo Miura, Tatsuji Sakamoto

Research output: Contribution to journalArticlepeer-review

46 Citations (Scopus)

Abstract

The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.

Original languageEnglish
Pages (from-to)637-642
Number of pages6
JournalIEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume10
Issue number4
DOIs
Publication statusPublished - 1987 Dec
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Engineering(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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