LIFE ESTIMATION FOR IC PLASTIC PACKAGES UNDER TEMPERATURE CYCLING BASED ON FRACTURE MECHANICS.

Asao Nishimura, Akihiro Tatemichi, Hideo Miura, Tatsuji Sakamoto

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. Fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens, and it was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range DELTA K. The crack propagation behavior in the package was estimated from the values of da/dN and DELTA K at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one, and the applicability of fracture mechanics to the package cracking problem is demonstrated.

Original languageEnglish
Pages (from-to)477-483
Number of pages7
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 1987 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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