Lateral grain size enlargement and surface flattening of Cu thin films by using adequate underlayers and by thermal annealing in ultra high vacuum

Kenichi Imakita, Masakiyo Tsunoda, Migaku Takahashi

    Research output: Contribution to journalArticlepeer-review

    Abstract

    The effects of body centered cubic (BCC) solid solution underlayers on the metallurgical size and flatness of Cu thin films, fabricated on them, were investigated. As the underlayer materials, Cr80Al20, Cr90Ni10, Cr80Fe20, Fe 75Cr25 and Fe were examined. Lateral grain size of the Cu films fabricated on the Cr-Al, Cr-Ni, Cr-Fe, Fe-Cr under layer was enlarged, comparing to that on the Fe underlayer. The difference between the surface energy (γSX) and the interfacial energy (γSLX-Cu) of these underlayer is close to the surface energy of Cu at the melting point (γS Cu(Tm)). However, the surface roughness of Cu films simultaneously increased with increasing the lateral grain size. In order to suppress the surface roughening of Cu films, post-thermal annealing procedure was applied under the ultra-high vacuum for the films fabricated on the Cr-Ni and Cr-Ni-Fe underlayers. We finally succeeded to enlarge the lateral grain diameter more than 100 nm for 50-nm-thick Cu films, maintaining a fiat surface (Ra = 0.32 nm).

    Original languageEnglish
    Pages (from-to)124-127
    Number of pages4
    JournalShinku/Journal of the Vacuum Society of Japan
    Volume47
    Issue number3
    DOIs
    Publication statusPublished - 2004

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Surfaces, Coatings and Films
    • Electrical and Electronic Engineering

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