@inproceedings{20486b69684e4eef8c50f62f948873de,
title = "Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating",
abstract = "The laser sintering of gold nanoparticles on a copper substrate was studied to develop an alternative to gold plating. The major problem in the gold coating on a copper substrate using gold nanoparticle ink is that copper atom easily diffuses to the surface through the gold layer and to form an oxide layer during the thermal sintering of gold nanoparticles. The depth profile of elemental composition of laser-sintered gold layer showed that the effective reduction of the diffusion of copper atom through the gold layer is possible because the laser sintering of metal nanoparticles is extremely fast process due to the nano-heater effect caused by the laser excitation of plasmon band.",
keywords = "Alternative to gold plating, Copper diffusion, Copper substrate, Depth profile analysis, Gold plating, Laser direct writing, Laser sintering, Metal nanoparticle ink",
author = "Akira Watanabe",
year = "2013",
month = jun,
day = "12",
doi = "10.1117/12.2001848",
language = "English",
isbn = "9780819493774",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
booktitle = "Laser-Based Micro- and Nanopackaging and Assembly VII",
note = "Laser-Based Micro- and Nanopackaging and Assembly VII, LBMP 2013 ; Conference date: 06-02-2013 Through 07-02-2013",
}