Laser sintering of gold nanoparticles on a copper substrate toward an alternative to gold plating

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The laser sintering of gold nanoparticles on a copper substrate was studied to develop an alternative to gold plating. The major problem in the gold coating on a copper substrate using gold nanoparticle ink is that copper atom easily diffuses to the surface through the gold layer and to form an oxide layer during the thermal sintering of gold nanoparticles. The depth profile of elemental composition of laser-sintered gold layer showed that the effective reduction of the diffusion of copper atom through the gold layer is possible because the laser sintering of metal nanoparticles is extremely fast process due to the nano-heater effect caused by the laser excitation of plasmon band.

Original languageEnglish
Title of host publicationLaser-Based Micro- and Nanopackaging and Assembly VII
DOIs
Publication statusPublished - 2013 Jun 12
EventLaser-Based Micro- and Nanopackaging and Assembly VII, LBMP 2013 - San Francisco, CA, United States
Duration: 2013 Feb 62013 Feb 7

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume8608
ISSN (Print)0277-786X

Other

OtherLaser-Based Micro- and Nanopackaging and Assembly VII, LBMP 2013
CountryUnited States
CitySan Francisco, CA
Period13/2/613/2/7

Keywords

  • Alternative to gold plating
  • Copper diffusion
  • Copper substrate
  • Depth profile analysis
  • Gold plating
  • Laser direct writing
  • Laser sintering
  • Metal nanoparticle ink

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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