Laser direct writing of conductive micropatterns using copper nanoparticle ink toward 3D interconnection

Akira Watanabe, Jinguang Cai

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    The formation of conductive micropatterns via laser direct writing using metal nanoparticle ink was studied toward 3D interconnection. Copper (Cu) micropatterns were fabricated by laser irradiation on a precursor film prepared via spin-coating of a Cu nanoparticle ink on a substrate. A focused laser beam was scanned on the copper nanoparticle film using a xyz motion control stage. The solution etching of the film after laser scanning gave a Cu micropattern via removing unirradiated area. A copper wiring with a hollow structure was fabricated by layer-by-layer 3D printing, where the spin-coating of Cu nanoparticle ink and the laser direct writing were repeated alternatively.

    Original languageEnglish
    Title of host publicationProceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages1119-1124
    Number of pages6
    ISBN (Electronic)9781467380751
    DOIs
    Publication statusPublished - 2016 May 19
    EventIEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan, Province of China
    Duration: 2016 Mar 142016 Mar 17

    Publication series

    NameProceedings of the IEEE International Conference on Industrial Technology
    Volume2016-May

    Other

    OtherIEEE International Conference on Industrial Technology, ICIT 2016
    Country/TerritoryTaiwan, Province of China
    CityTaipei
    Period16/3/1416/3/17

    Keywords

    • 3D interconnection
    • 3D printing
    • copper nanoparticle ink
    • copper wiring
    • hollow structure
    • hollow wiring
    • laser direct writing
    • layer-by-layer method
    • microbridge

    ASJC Scopus subject areas

    • Computer Science Applications
    • Electrical and Electronic Engineering

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