Laser direct writing of conductive micropatterns using copper nanoparticle ink toward 3D interconnection

Akira Watanabe, Jinguang Cai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The formation of conductive micropatterns via laser direct writing using metal nanoparticle ink was studied toward 3D interconnection. Copper (Cu) micropatterns were fabricated by laser irradiation on a precursor film prepared via spin-coating of a Cu nanoparticle ink on a substrate. A focused laser beam was scanned on the copper nanoparticle film using a xyz motion control stage. The solution etching of the film after laser scanning gave a Cu micropattern via removing unirradiated area. A copper wiring with a hollow structure was fabricated by layer-by-layer 3D printing, where the spin-coating of Cu nanoparticle ink and the laser direct writing were repeated alternatively.

Original languageEnglish
Title of host publicationProceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1119-1124
Number of pages6
ISBN (Electronic)9781467380751
DOIs
Publication statusPublished - 2016 May 19
EventIEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan, Province of China
Duration: 2016 Mar 142016 Mar 17

Publication series

NameProceedings of the IEEE International Conference on Industrial Technology
Volume2016-May

Other

OtherIEEE International Conference on Industrial Technology, ICIT 2016
CountryTaiwan, Province of China
CityTaipei
Period16/3/1416/3/17

Keywords

  • 3D interconnection
  • 3D printing
  • copper nanoparticle ink
  • copper wiring
  • hollow structure
  • hollow wiring
  • laser direct writing
  • layer-by-layer method
  • microbridge

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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