Knudsen pump based on silicon etching and thermal oxidation process for on-chip vacuum pumping

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work reports the fabrication and evaluation of Knudsen pump for on-chip vacuum pumping. Three AFM (atomic force microscope) cantilevers are integrated into small chambers with a size of 5 mm × 3 mm × 0.4 mm for the pump's evaluation. Knudsen pump is fabricated using deep RIE (reactive ion etching), wet thermal oxidation and anodic bonding processes. The fabricated device is evaluated, which based on monitoring the quality (Q) factor of the integrated cantilevers. The Q factor of the cantilever is increased from 300 to 1150 in cases without and with a temperature difference approximately 25°C between the top (hot side at 40°C) and bottom (cool side at 15°C) sides of the fabricated device, respectively. The evacuated pressure chamber of around 10 kPa is estimated by the Q factor of the integrated cantilevers.

Original languageEnglish
Title of host publication2017 IEEE 12th International Conference on Power Electronics and Drive Systems, PEDS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages550-552
Number of pages3
ISBN (Electronic)9781509023646
DOIs
Publication statusPublished - 2018 Feb 9
Event12th IEEE International Conference on Power Electronics and Drive Systems, PEDS 2017 - Honolulu, United States
Duration: 2017 Dec 122017 Dec 15

Publication series

NameProceedings of the International Conference on Power Electronics and Drive Systems
Volume2017-December
ISSN (Print)2164-5256
ISSN (Electronic)2164-5264

Other

Other12th IEEE International Conference on Power Electronics and Drive Systems, PEDS 2017
CountryUnited States
CityHonolulu
Period17/12/1217/12/15

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Van Toan, N., Inomata, N., Trung, N. H., & Ono, T. (2018). Knudsen pump based on silicon etching and thermal oxidation process for on-chip vacuum pumping. In 2017 IEEE 12th International Conference on Power Electronics and Drive Systems, PEDS 2017 (pp. 550-552). (Proceedings of the International Conference on Power Electronics and Drive Systems; Vol. 2017-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PEDS.2017.8289155