Kinetic roughening in electrodissolution of copper

Atsushi Iwamoto, Tatsuo Yoshinobu, Hiroshi Iwasaki

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

We studied kinetic roughening of copper surfaces electrochemically dissolved at constant current densities by atomic force microscopy. The surface was found to roughen with time and the surface width increased with the length scale with the roughness exponent α of [Formula Presented] in the stationary state. This value is different from that in electrochemical deposition, 0.87, under the stable growth condition [A. Iwamoto et al., Phys. Rev. Lett. 72, 4025 (1994)]. The observed roughening in the dissolution process is discussed in terms of nonlocal effects.

Original languageEnglish
Pages (from-to)5133-5136
Number of pages4
JournalPhysical Review E - Statistical Physics, Plasmas, Fluids, and Related Interdisciplinary Topics
Volume59
Issue number5
DOIs
Publication statusPublished - 1999 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Statistical and Nonlinear Physics
  • Mathematical Physics
  • Condensed Matter Physics
  • Physics and Astronomy(all)

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