JOINING OF REACTION BONDED Si//3N//4 USING Al.

Yuichi Ikuhara, Masanori Kobayashi, Hideo Yoshinaga

    Research output: Contribution to journalArticlepeer-review

    4 Citations (Scopus)

    Abstract

    In order to develop a joining technique for reaction bonded Si//3N//4 which ensures good high-temperature strength of joined body, Al foil was used as an insert material. The joining was conducted in 1 atm N//2 atmosphere at temperatures from 1470 to 1970 K, under pressures up to 20 MPa for 1800 s. Direct joining without any insert material was also carried out for comparison. The microstructure of joined regions was observed with a high resolution electron microscope, and the strength of the interface was measured by 3-point bending test as a function of joining temperature and joining pressure. The results obtained are summarized.

    Original languageEnglish
    Pages (from-to)921-928
    Number of pages8
    JournalYogyo Kyokai Shi/Journal of the Ceramic Society of Japan
    Volume95
    Issue number9
    Publication statusPublished - 1987 Sep 1

    ASJC Scopus subject areas

    • Engineering(all)

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