Isothermal relaxation behavior in a Pd42.5Cu30Ni 7.5P20 metallic glass

Osami Haruyama, Hisamichi M. Kimura, Nobuyuki Nishiyama, Akihisa Inoue

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

The structural relaxation process was investigated for a Pd 42.5Cu30Ni7.5P20 metallic glass (bulk and ribbon samples) isothermally annealed at 566 and 573 K just below glass transition temperature Tg = 576 K. The relaxation process was examined by differential scanning calorimetry (DSC) and electrical resistmetry. Then, the resistivity of bulk glass was exactly estimated from the resistance and the geometry of the sample. Although the DSC absorption peak appeared just after glass transition became larger with the progress of the relaxation, the growth was terminated after annealing for 6 × 103 s at 566 K or 6 × 102 s at 573 K, meaning that the free volume content reached a constant value and a fully relaxed state was attained. The corresponding change was also seen in the room temperature residual resistivity p(300) during relaxing at 566 K. Then, the ρ(300) increased with time for initial 6 × 103 s and was constant during further 6 × 104 s.

Original languageEnglish
Pages (from-to)1184-1188
Number of pages5
JournalMaterials Transactions
Volume45
Issue number4
DOIs
Publication statusPublished - 2004 Apr 1

Keywords

  • Bulk metallic glass
  • Electrical resistivity
  • Glass transition
  • Structural relaxation

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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