IR sensor array using photo-patternable temperature sensitive paint for thermal imaging

Research output: Contribution to journalArticlepeer-review

Abstract

This paper reports an infrared-to-visible transducer array made of temperature sensitive paint (TSP) for a low-cost thermal imaging application. A novel fabrication process using a photo-patternable temperature sensitive paint (PTSP) combined with an SU-8 transfer method was developed. A PTSP microstructure as small as 2 μm was successfully patterned by the normal photolithography process, and sensitivity as high as -0.5%/°C was obtained. The proposed method simplifies the fabrication process, and prevents the TSP from plasma-induced damage. A self-suspended structure as small as 70 μm was successfully fabricated with a large-gap of 40 μm from the substrate. The heated object at 250 °C was detectable with a spatial resolution of about 380 μm.

Original languageEnglish
Article number104011
JournalJournal of Micromechanics and Microengineering
Volume25
Issue number10
DOIs
Publication statusPublished - 2015 Sep 24

Keywords

  • Eu(TTA)
  • infrared thermal imaging
  • temperature sensitive paint

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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