This paper reports an infrared-to-visible transducer array made of temperature sensitive paint (TSP) for a low-cost thermal imaging application. A novel fabrication process using a photo-patternable temperature sensitive paint (PTSP) combined with an SU-8 transfer method was developed. A PTSP microstructure as small as 2 μm was successfully patterned by the normal photolithography process, and sensitivity as high as -0.5%/°C was obtained. The proposed method simplifies the fabrication process, and prevents the TSP from plasma-induced damage. A self-suspended structure as small as 70 μm was successfully fabricated with a large-gap of 40 μm from the substrate. The heated object at 250 °C was detectable with a spatial resolution of about 380 μm.
- infrared thermal imaging
- temperature sensitive paint
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering