Investigation on wirebond-less power module structure with high-density packaging and high reliability

Yoshinari Ikeda, Yuji Iizuka, Yuichiro Hinata, Masafumi Horio, Motohito Hori, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

46 Citations (Scopus)

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Engineering & Materials Science