Investigation on wirebond-less power module structure with high-density packaging and high reliability

Yoshinari Ikeda, Yuji Iizuka, Yuichiro Hinata, Masafumi Horio, Motohito Hori, Yoshikazu Takahashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

43 Citations (Scopus)

Abstract

A newly developed module with wirebond-less structure is investigated. This structure has multi-pin attached interconnection structure implanted into power circuit board with connecting line between chips and other elements inside the power module. Additionally, heat-spreader-like copper blocks bonded to ceramic insulated substrates performing high thermal conductivity, enable to realize high current capability operations effectively. Moreover, full molded resin package performs higher reliability comparing with the conventional module, shows the package structure is one of the potential candidates of power module for the high power applications including Wide Band Gap (WBG) devices.

Original languageEnglish
Title of host publicationISPSD 2011 - Proceedings of the 23rd International Symposium on Power Semiconductor Devices and ICs
Pages272-275
Number of pages4
DOIs
Publication statusPublished - 2011 Dec 1
Externally publishedYes
Event23rd International Symposium on Power Semiconductor Devices and ICs, ISPSD 2011 - San Diego, CA, United States
Duration: 2011 May 232011 May 26

Publication series

NameProceedings of the International Symposium on Power Semiconductor Devices and ICs
ISSN (Print)1063-6854

Other

Other23rd International Symposium on Power Semiconductor Devices and ICs, ISPSD 2011
Country/TerritoryUnited States
CitySan Diego, CA
Period11/5/2311/5/26

ASJC Scopus subject areas

  • Engineering(all)

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