Investigation of TSV Liner Interface with Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC

Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Mixed-signal 3D-ICs have a stacked structure of digital and analog circuit chips. In this study, the effect of noise propagation from a digital circuit on an analog circuit was evaluated using an actual mixed-signal 3D-IC. The noise propagation via through-silicon vias (TSVs) was measured, with a ring-oscillator as a noise source. For a comprehensive investigation, TSV-liner interface states were evaluated along the depth direction using unique multiwell-structured TSVs and a charge-pumping method. It was considered that the interface traps and nonconformal thickness of the TSV liner increased the noise propagation among stacked chips.

Original languageEnglish
Article number8805089
Pages (from-to)1225-1231
Number of pages7
JournalIEEE Journal of the Electron Devices Society
Volume7
DOIs
Publication statusPublished - 2019

Keywords

  • 3D IC
  • charge pumping method
  • interface trap
  • through-silicon vias

ASJC Scopus subject areas

  • Biotechnology
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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