Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The three-dimensional (3D) integration process is a promising candidate to enhance electron-device performance. Typical 3D integration systems consist of vertically stacked several thin IC chips that are electrically connected with lots of through-Si vias (TSVs) and metal microbumps. Metal microbumps are surrounded by organic adhesive. An epoxy-based material, so-called underfill, has been widely used to fill the gap between several chips. In general, the coefficient of thermal expansion (CTE) of the underfill material is larger than that of metal microbumps. This CTE mismatch induces local bending stress in thinned IC chips. This local bending stress would affect the CMOS circuit in thinned IC chips. Therefore, we should suppress the local bending stress to realize 3D IC with high reliability. To suppress the local bending stress, we have proposed a novel underfill with negative-Thermal-expansion material. In this study, we investigated the characteristics of the negativethermal-expansion material surrounded by the matrix of the underfill.

Original languageEnglish
Title of host publicationIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728148700
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
Duration: 2019 Oct 82019 Oct 10

Publication series

NameIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
CountryJapan
CitySendai
Period19/10/819/10/10

Keywords

  • component
  • formatting
  • insert (key words)
  • style
  • styling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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