Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding

Koki Tanaka, Wei Shan Wang, Mario Baum, Joerg Froemel, Hideki Hirano, Shuji Tanaka, Maik Wiemer, Thomas Otto

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Investigation of surface pre-treatment methods for wafer-level Cu-Cu thermo-compression bonding'. Together they form a unique fingerprint.

Engineering & Materials Science