Investigation of specimen- and grain-size dependence of yield stress in electrodeposited nanocrystalline copper through micropillar compression

Norihiko L. Okamoto, Daisuke Kashioka, Haruyuki Inui

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The specimen-size dependence of yield stress of nanocrystalline copper with average grain size (d) of 360 nm has been investigated through uniaxial compression tests of micrometer-size pillars fabricated via the focused ion beam method. The yield stress decreases with the decrease in the micropillar size while the yield stress is almost constant for larger micropillars. The critical specimen size (t) is approximately 12.5 μm, correspoinding to the critical (t/d) value, (t/d)*, of 35, which is much larger than that for coarse-grained copper polycrystals.

Original languageEnglish
Title of host publicationMechanical Behavior of Metallic Nanostructured Materials
PublisherMaterials Research Society
Pages18-23
Number of pages6
ISBN (Print)9781632661067
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2012 MRS Fall Meeting - Boston, MA, United States
Duration: 2012 Nov 252012 Nov 30

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1513
ISSN (Print)0272-9172

Other

Other2012 MRS Fall Meeting
CountryUnited States
CityBoston, MA
Period12/11/2512/11/30

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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