Investigation of flat-pack IGBT reliability

Humiaki Kirihata, Yoshikazu Takahashi, Hiroki Wakimoto, Fumisato Niino

Research output: Contribution to journalConference articlepeer-review

10 Citations (Scopus)

Abstract

High power and high reliable IGBTs are used in applications to tractions and high voltage converters. We have investigated a flat-pack IGBT, compared with an IGBT module and a GTO, to realize the ruggedness in electrical, thermal and mechanical stresses, and the long term reliability. The thermo-mechanical behaviors on the Si chip surface are discussed, on two-dimensional numerical simulation results and power cycling test results.

Original languageEnglish
Pages (from-to)1016-1021
Number of pages6
JournalConference Record - IAS Annual Meeting (IEEE Industry Applications Society)
Volume2
Publication statusPublished - 1998 Dec 1
Externally publishedYes
EventProceedings of the 1998 IEEE Industry Applications Conference. Part 1 (of 3) - St.Louis, MO, USA
Duration: 1998 Oct 121998 Oct 15

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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