Investigation of Design Factors for Evaluating Contact Joint Reliability Consisting of an Anisotropic Conductive Film (ACF)

Naotaka Tanaka, Yoshiyuki Kado, Kenya Kawano, Ikuo Yoshida, Hideo Miura

Research output: Contribution to journalArticlepeer-review

Abstract

The application of anisotropic conductive films (ACF) to form interconnections between chips and substrates is one potential variation of flip chip technologies. Its appeal comes from the possibilities of forming very fine pitch interconnections that are not feasible with solder, avoiding the use of lead, and achieving simpler, lower cost processing. In this study, we evaluate the interconnection reliability of ACF joints based on a contact conductive mechanism by using a contact analysis. We have clarified the influence of the material properties of the ACF and the build-up substrate on the interconnection reliability during temperature cycling. The key factor that dominates the interconnection reliability is the amount of plastic strain of the Au bump at the contact face. Therefore, it is very important to control the plastic deformation of the Au bump. On the other hand, we found that the interconnection reliability during moisture resistance testing may deteriorate due to stress relaxation at near the grass transition temperature of the commonly used build-up material.

Original languageEnglish
Pages (from-to)568-573
Number of pages6
Journaljournal of the japan institute of electronics packaging
Volume5
Issue number6
DOIs
Publication statusPublished - 2004 Jan 1
Externally publishedYes

Keywords

  • ACF
  • Au Bump
  • Contact Stress
  • Plastic Strain
  • Reliability
  • Stress Relaxation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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