TY - GEN
T1 - Intra-and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal
AU - Murugesan, M.
AU - Fukushima, T.
AU - Bea, J. C.
AU - Hashimoto, H.
AU - Koyanagi, Mitsumasa
PY - 2018/5/25
Y1 - 2018/5/25
N2 - Advanced directed-self-assembly (DSA) has been deployed to form vertical cylindrical structures inside deep Si trenches and via with the cylinders' width at nm-scale for making electrical interconnection in the vertically stacked 3D-LSIs/ICs. DSA reaction for PS(57k)-b-PMMA(25k) diblock copolymer (DBC) with PS:PMMA ratio as 2:1 have resulted into the formation of 20 nm-width nano-cylinders (NC) running parallel and straight up to > 7 μm inside the 10 μm-deep Si trenches. Upon increasing the molecular weight of PS from 57k to 140k (keeping the ratio of DBC as 2:1), the width of NC has enlarged from 20 nm to > 80 nm. A ∼100 nm-width metal interconnects were formed inside the ∼500 nm-width via of the bonded 3D-ICs, for Sn and In metals. Based on Self Consistent Field theory, both 2D & 3D simulation results showed that the metal particles attached to PMMA of DBC are connected vertically and forms cylinder, as long as the metal particles are well attached to PMMA.
AB - Advanced directed-self-assembly (DSA) has been deployed to form vertical cylindrical structures inside deep Si trenches and via with the cylinders' width at nm-scale for making electrical interconnection in the vertically stacked 3D-LSIs/ICs. DSA reaction for PS(57k)-b-PMMA(25k) diblock copolymer (DBC) with PS:PMMA ratio as 2:1 have resulted into the formation of 20 nm-width nano-cylinders (NC) running parallel and straight up to > 7 μm inside the 10 μm-deep Si trenches. Upon increasing the molecular weight of PS from 57k to 140k (keeping the ratio of DBC as 2:1), the width of NC has enlarged from 20 nm to > 80 nm. A ∼100 nm-width metal interconnects were formed inside the ∼500 nm-width via of the bonded 3D-ICs, for Sn and In metals. Based on Self Consistent Field theory, both 2D & 3D simulation results showed that the metal particles attached to PMMA of DBC are connected vertically and forms cylinder, as long as the metal particles are well attached to PMMA.
KW - directed-self-assembly (DSA)
KW - three-dimensional integration (3D-LSI/IC)
KW - through-Si via (TSV)
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U2 - 10.1109/IRPS.2018.8353589
DO - 10.1109/IRPS.2018.8353589
M3 - Conference contribution
AN - SCOPUS:85046964664
T3 - IEEE International Reliability Physics Symposium Proceedings
SP - 4D.21-4D.27
BT - 2018 IEEE International Reliability Physics Symposium, IRPS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 IEEE International Reliability Physics Symposium, IRPS 2018
Y2 - 11 March 2018 through 15 March 2018
ER -