Interpack welcome

Roger Schmidt, Hideo Miura, Jeffrey C. Suhling

Research output: Contribution to journal › Editorial › peer-review

Original language	English
Pages (from-to)	iii
Journal	2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume	1
Publication status	Published - 2007 Dec 1
Externally published	Yes
Event	ASME Electronic and Photonics Packaging Division - Vancouver, BC, United States Duration: 2007 Jul 8 → 2007 Jul 12

ASJC Scopus subject areas

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title = "Interpack welcome",

author = "Roger Schmidt and Hideo Miura and Suhling, {Jeffrey C.}",

year = "2007",

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day = "1",

language = "English",

volume = "1",

pages = "iii",

journal = "2007 Proceedings of the ASME InterPack Conference, IPACK 2007",

note = "ASME Electronic and Photonics Packaging Division ; Conference date: 08-07-2007 Through 12-07-2007",

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AU - Miura, Hideo

AU - Suhling, Jeffrey C.

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JO - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007

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T2 - ASME Electronic and Photonics Packaging Division

Y2 - 8 July 2007 through 12 July 2007

ER -